PRINTED CIRCUIT BOARD
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United States of America Patent
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app pub date -
Aug 30, 2017
filing date -
May 27, 2015
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Abstract
A printed circuit board includes a base layer, a first conductive pattern, and a first surface treatment patterned layer formed on a portion of a surface of the first conductive pattern. The first conductive pattern includes a first copper foil layer on one side of the base layer and a first conductive layer on a portion of a surface of the first copper foil layer. The first conductive pattern which is covered by the first surface treatment patterned layer has sidewalls obliquely tilted with respect to the base layer. The first conductive pattern covered with the first surface treatment patterned layer has a cross section that is trapezoidal shaped, and a width which gradually decreases from the base layer to the first conductive layer.
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