METHOD AND APPARATUS FOR MINIMIZING VIA COMPRESSION IN A FLUID EJECTION HEAD
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United States of America Patent
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Jun 21, 2016
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Jun 21, 2016
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Abstract
A fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a fluid ejection head assembly. The fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein and a semiconductor chip attached in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive. A compression prevention body having a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C. disposed adjacent to the fluid supply port of the fluid supply body and the semiconductor chip.
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