MEMS microphone and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10785557
APP PUB NO 20170359648A1
SERIAL NO

15620946

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.

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Patent Owner(s)

Patent OwnerAddress
DB HITEK CO LTDSEOUL

International Classification(s)

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  • 2017 Application Filing Year
  • B81C Class
  • 493 Applications Filed
  • 331 Patents Issued To-Date
  • 67.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Han Choon Seoul, KR 56 616
Park, Dong Chun Incheon, KR 4 25

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Patent Citation Ranking

  • 1 Citation Count
  • B81C Class
  • 60 % this patent is cited more than
  • 5 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges6401 - 1000.511.522.533.544.555.566.5

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