Semiconductor device, communication system, and method of manufacturing semiconductor device

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United States of America Patent

PATENT NO 10784587
APP PUB NO 20170358867A1
SERIAL NO

15603468

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Abstract

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A semiconductor device includes a semiconductor chip including a communication circuit, a first antenna element formed in a first rewiring layer covering a first surface of the semiconductor chip and connected to the communication circuit, and a second antenna element formed in a second rewiring layer covering a second surface on the side opposite to the first surface of the semiconductor chip and connected to the communication circuit.

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Patent Owner(s)

Patent OwnerAddress
LAPIS SEMICONDUCTOR CO LTD2-4-8 SHINYOKOHAMA KOUHOKU-KU YOKOHAMA 222-8575

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akahori, Hiroji Yokohama, JP 72 206

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