Semiconductor device, communication system, and method of manufacturing semiconductor device

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United States of America Patent

PATENT NO 10784587
APP PUB NO 20170358867A1
SERIAL NO

15603468

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Abstract

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A semiconductor device includes a semiconductor chip including a communication circuit, a first antenna element formed in a first rewiring layer covering a first surface of the semiconductor chip and connected to the communication circuit, and a second antenna element formed in a second rewiring layer covering a second surface on the side opposite to the first surface of the semiconductor chip and connected to the communication circuit.

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Patent Owner(s)

Patent OwnerAddress
LAPIS SEMICONDUCTOR CO LTDKANAGAWA KANAGAWA

International Classification(s)

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  • 2017 Application Filing Year
  • H01Q Class
  • 2969 Applications Filed
  • 2411 Patents Issued To-Date
  • 81.21 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akahori, Hiroji Yokohama, JP 72 206

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges605999381121101 - 1011 - 2021 - 3031 - 4051 - 6071 - 8005010015020025030035040045050055060065070075080085090095010001050

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