Method of manufacturing wiring board, method of manufacturing light emitting device using the wiring board, wiring board, and light emitting device using the wiring board
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United States of America Patent
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Oct 6, 2020
Grant Date -
Dec 14, 2017
app pub date -
May 19, 2017
filing date -
May 20, 2016
priority date (Note) -
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Abstract
A method of manufacturing a wiring board according to one embodiment of the present disclosure includes: providing at least one first conductive member that serves as part of a wiring; covering the at least one first conductive member with an insulating member that has at least one opening; disposing at least one second conductive member on the opening of the insulating member, the second conductive member serving as part of the wiring; electrically joining the at least one first conductive member and the at least one second conductive member to each other at the opening; and cutting a region including the at least one first conductive member, the insulating member, and the at least one second conductive member, to form an element mounting surface.
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