LED LEADFRAME AND LED PACKAGING STRUCTURE
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United States of America Patent
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app pub date -
May 8, 2017
filing date -
Jun 13, 2016
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Abstract
A LED leadframe and a LED packaging structure adopting the same are provided. The LED leadframe includes an insulating substrate, a first electrode pad and a second electrode pad. The insulating substrate is formed with a bowl-shaped die bonding region and a strip-like insulating portion in the bowl-shaped die bonding region. The first and second electrode pads are fixed on the insulating substrate and disposed on a bottom of the die bonding region and whereby are separated by the strip-like insulating portion. The strip-like insulating portion has at least one bend. The structural design of the electrode pads of the LED leadframe makes a size of one of the electrode pads such as the positive electrode pad be available for a bonding machine to perform wire bonding or for placing a Zener diode chip and meanwhile makes the other electrode pad be as large as possible.
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