MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
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United States of America Patent
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Jun 13, 2017
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Jun 14, 2016
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Abstract
A manufacturing method of a semiconductor package includes disposing one or more semiconductor devices on a base substrate, each of the one or more semiconductor devices having an external terminal; forming a frame on the base substrate, the frame surrounding the one or more semiconductor devices; and forming a resin insulating layer inside the frame, the resin insulating layer sealing the one or more semiconductor devices and the resin insulating layer including a resin insulating material; wherein a surface of each of the one or more semiconductor devices on which the external terminal is not provided faces the base substrate.
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