A module IC package structure having a metal shielding function includes a substrate unit, an electronic unit, a shielding unit, and an insulative unit. The substrate unit includes a substrate body and at least one grounding pad disposed on the substrate body. The electronic unit includes at least one electronic module disposed on the circuit substrate and electrically connected to the circuit substrate. The shielding unit includes a metal shielding layer formed on an external surface of the at least one electronic module, and the metal shielding layer contacts the at least one grounding pad. The insulative unit includes an insulative layer formed on an external surface of the metal shielding layer. Hence, the module IC package structure can be used to prevent electrical malfunction induced by short-circuit due to the design of forming the insulative layer formed on the external surface of the metal shielding layer.

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