MODULAR DATA CENTER FACILITY WITH COOLING MODULES

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United States of America Patent

SERIAL NO

15173391

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A modular housing encloses a data center and a modular cooling system. The modular cooling system includes a modular cooling pallet on which cooling modules are installed. Each cooling module can have different cooling properties and may cool air to a different temperature than that of air cooled by other cooling modules. This can fulfill the different cooling needs among different computers that reside in the data center. The modular housing may also provide features that enable it to be quickly assembled at an operating site. The modular housing may comprise wall structures, roof structures, and a floor structure that are embedded with fastening features, which eliminates use of loose fasteners used for assembly. The floor structure may be made of rack pallets that provide wire ways through which connections can be routed, which simplifies the wiring process when assembling the modular housing on site.

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Patent Owner(s)

Patent OwnerAddress
HDT EXPEDITIONARY SYSTEMS INC30500 AURORA ROAD SOLON OH 44139

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deighton, Charles Milford, US 8 14
Milek, Wade Florence, US 8 14

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