Microspeaker Enclosure with Porous Materials in Resonance Space

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United States of America Patent

SERIAL NO

15615155

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Abstract

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The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.

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Patent Owner(s)

Patent OwnerAddress
EM-TECH CO LTDBUSAN SOUTH KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Kyu Dong Gyeongsangnam-do, KR 10 95
Ha, Jong Heon Gyeongsangnam-do, KR 2 10
Oh, Hyeon Taek Gyeongsangnam-do, KR 5 34

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