COATED SOLDER WIRE AND METHOD FOR MANUFACTURING SAME

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United States of America Patent

SERIAL NO

15536330

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Abstract

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Provided is a manufacturing method in which a coated solder wire having a dense polysiloxane coating film that is uniformly provided over the entire surface of the solder wire can be efficiently obtained in a single process. A coated solder wire is obtained by a manufacturing method that includes; a radicalization step for forming a radicalized organic silicon compound by mixing a reaction gas that has been plasmatized under atmospheric pressure and an organic silicon compound that is introduced by way of a carrier gas, and radicalizing that organic silicon compound; a reaction area formation step for forming a reaction area that is defined by a helical gas flow and in which the radicalized organic silicon compound is uniformly dispersed; and a coating step for forming a 4 nm to 200 nm thick polysiloxane coating film on the surface of a solder wire by transporting a solder wire inside the reaction area and causing the radicalized organic silicon compound to react with metal on the surface of that solder wire.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO METAL MINING CO LTD11-3 SHIMBASHI 5-CHOME MINATO-KU TOKYO 105-8716

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOBAYASHI, Hiroshi CHIBA, JP 902 9719
YAMABE, Hidetoshi CHIBA, JP 15 45

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