COATED SOLDER WIRE AND METHOD FOR MANUFACTURING SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Dec 16, 2015
filing date -
Dec 19, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Provided is a manufacturing method in which a coated solder wire having a dense polysiloxane coating film that is uniformly provided over the entire surface of the solder wire can be efficiently obtained in a single process. A coated solder wire is obtained by a manufacturing method that includes; a radicalization step for forming a radicalized organic silicon compound by mixing a reaction gas that has been plasmatized under atmospheric pressure and an organic silicon compound that is introduced by way of a carrier gas, and radicalizing that organic silicon compound; a reaction area formation step for forming a reaction area that is defined by a helical gas flow and in which the radicalized organic silicon compound is uniformly dispersed; and a coating step for forming a 4 nm to 200 nm thick polysiloxane coating film on the surface of a solder wire by transporting a solder wire inside the reaction area and causing the radicalized organic silicon compound to react with metal on the surface of that solder wire.
First Claim
Other Claims data not available