SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT
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United States of America Patent
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Dec 9, 2015
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Dec 15, 2014
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The disclosed solder alloy is useful for plating and for use with electronic components, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass % inclusive and the remainder including Sn, and is used in electrical contacts that are electrically connected through mechanical joining.
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