Implant having porous layer and molding method thereof
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United States of America Patent
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Mar 30, 2021
Grant Date -
Dec 7, 2017
app pub date -
May 25, 2017
filing date -
Jun 1, 2016
priority date (Note) -
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Abstract
An implant having a porous layer and a molding method thereof includes: a substrate having a bone contact surface being in part in direct contact with a bone of a patient; a porous layer having a void inside; a connecting layer disposed between the bone contact surface and the porous layer to attach the bone contact surface to the porous layer; and a rib detachably coupled to the porous layer, wherein the connecting layer includes at least one constituent component identical to one of constituent components in the bone contact surface to be integrated into the porous layer and the bone contact surface, thereby firmly attaching the porous layer to the bone contact surface. Accordingly, bonding of dissimilar metals is facilitated by inducing the attachment of the bone contact surface of the implant to the porous layer having a void inside, formed by dissimilar metals, through the connecting layer including at least one constituent component identical to one of constituent components of the bone contact surface.
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