PACKAGE INCLUDING STACKED DIE AND PASSIVE COMPONENT
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United States of America Patent
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May 27, 2016
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May 27, 2016
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Abstract
Disclosed herein is an electronic device including a substrate having a conductive area formed thereon. A first molding level is stacked on the substrate. A die is formed on the substrate and within the first molding level. A second molding level is stacked on the first molding level. At least one passive component is within the second molding level. A conductive structure extends between the second molding level and the substrate and electrically couples the at least one passive component to the conductive area.
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