ELECTRONIC DEVICE WITH STACKED ELECTRONIC CHIPS
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United States of America Patent
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Issued Date -
Nov 30, 2017
app pub date -
Dec 27, 2016
filing date -
May 26, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic device includes a carrier substrate, a first electronic chip and a second chip. The first chip is mounted on the carrier substrate via interposed electrical connection elements electrically connecting a front electrical connection network of the first chip and an electrical connection network of the carrier substrate. The second chip is mounted on the first chip via interposed electrical connection elements electrically connecting a front electrical connection network of the second chip and a back electrical connection network of the first chip Electrical connection wires electrically connect the back electrical connection network of the first chip to the electrical connection network of the carrier substrate.
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