METHOD FOR MAKING EMI SHIELDING LAYER ON A PACKAGE
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United States of America Patent
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Issued Date -
Nov 30, 2017
app pub date -
Sep 13, 2016
filing date -
May 25, 2016
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Abstract
A method for making EMI shielding layer of a package is disclosed to include the steps of: a) disposing a UV curable adhesive, which can be thermally released, on a surface of a package panel having solder pads to cover the solder pads; b) curing the UV curable adhesive; c) performing a singulating process to form the plurality of the packages disposed by the UV curable adhesive; d) forming an EMI shielding layer on the package; and e) thermally releasing the UV curable adhesive.
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