Multilayer wiring substrate, display unit, and electronic apparatus
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United States of America Patent
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Feb 23, 2021
Grant Date -
Nov 30, 2017
app pub date -
Nov 11, 2015
filing date -
Dec 5, 2014
priority date (Note) -
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Abstract
In a case of a multilayer wiring structure in which an insulating layer provided between wires is made of a material having high transmittance of light in a visible range containing ultraviolet rays, wires in the upper layer and those in a lower layer may be recognized together when defects of an upper layer are visually inspected. In this case, the lower layer may be noise for the inspection of the wires in the upper layer, lowering inspection accuracy. This lowered inspection accuracy has inhibited improvement in manufacturing yields and reliability. In order to solve this issue, a multilayer wiring substrate of the disclosure includes: a substrate; and a first wire and a second wire that are provided on the substrate with an insulating layer having a light transmitting property in between, and one or both of which are subjected to a surface treatment.
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