Wafer processing device and method therefor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10658214
APP PUB NO 20170345696A1
SERIAL NO

15531320

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed in this invention is a wafer processing apparatus and method for pre-alignment and edge exposure of a wafer. The wafer processing apparatus includes a pre-alignment module, an edge exposure module, a motion module, a control module and a rotary table. The motion module includes a rotation module, a lifting module and a translation module, which are disposed and interconnected above one another. The rotation module is connected at the top to the rotary table and is configured to drive the rotary table to rotate together with the wafer. The lifting module is configured to drive the rotation module and the rotary table to move vertically. The translation module is configured to drive the lifting module and the rotation module to move horizontally. The pre-alignment module and the edge exposure module are positioned in correspondence to opposing sides of the wafer. The invention reduces the number of objects to be controlled as well as the complexity in control and system structure. Additionally, it simplifies the pre-alignment operation and reduces equipment cost.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI MICRO ELECTRONICS EQUIPMENT CO LTD201203 NO 1525 EAST CHEUNG ROAD SHANGHAI PUDONG NEW AREA MUNICIPAL DISTRICT SHANGHAI CITY 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jiang, Jie Shanghai, CN 118 715
Ruan, Dong Shanghai, CN 12 75
Tian, Cuixia Shanghai, CN 2 6
Wang, Gang Shanghai, CN 1411 9119
Wang, Shaoyu Shanghai, CN 6 63

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