LAMINATE FOR BLISTER PACK, BLISTER PACK USING SAME, BLISTER PACK PACKAGE, AND METHOD FOR MANUFACTURING SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Oct 23, 2015
filing date -
Oct 23, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The present invention provides a laminate for blister packs which is not susceptible to molding failures even if a pocket is formed to a certain depth in order to pack the contents of large drug or the like. The present invention provides a laminate for blister packs, the laminate having a substrate film, an adhesive resin layer having a thickness of 25-100 μm, and an absorption film in this order. The absorption film comprises an absorption layer including a thermoplastic resin and an inorganic absorbent.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully