SPLIT VIA SECOND DRILL PROCESS AND STRUCTURE
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United States of America Patent
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app pub date -
Jun 7, 2016
filing date -
May 18, 2016
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Abstract
A printed circuit board has multiple stacked layers laminated together. A through hole is formed through the laminated stack, and plating is applied to the side walls of the though hole, thereby forming a plated through hole. Second through holes are then formed through the laminated stack, where each second through hole overlaps an edge of the plated through hole. By aligning the second through holes at the edge of the plated through hole, the plating of the plated through hole coincident with each second through hole is removed, thereby separating the plated through hole into two separate circuit paths. Forming second through holes in this manner effectively splits the circuit path of the plated through hole into multiple separate circuit paths, which increases the circuit density of the printed circuit board.
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