Semiconductor package including flip chip mounted IC and vertically integrated inductor
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United States of America Patent
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Jun 25, 2019
Grant Date -
Nov 23, 2017
app pub date -
May 20, 2016
filing date -
May 20, 2016
priority date (Note) -
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Abstract
In one implementation, a semiconductor package includes an integrated circuit (IC) flip chip mounted on a first patterned conductive carrier, a second patterned conductive carrier situated over the IC, and a magnetic material situated over the second patterned conductive carrier. The semiconductor package also includes a third patterned conductive carrier situated over the magnetic material. The second patterned conductive carrier and the third patterned conductive carrier are electrically coupled so as to form windings of an integrated inductor in the semiconductor package.
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