MANUFACTURING METHOD OF PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Nov 23, 2017
app pub date -
May 2, 2017
filing date -
May 17, 2016
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Abstract
A manufacturing method of a package structure is provided. The method includes the following steps. A redistribution circuit layer is formed on a first carrier. A die is disposed on the redistribution circuit layer. An encapsulant is formed to encapsulate the die. The first carrier is removed to expose a surface of the redistribution circuit layer. A plurality of recesses are formed on the surface of the redistribution circuit layer. A plurality of conductive terminals are formed corresponding to the recesses on the redistribution circuit layer. Another manufacturing method of a package structure is also provided.
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