Semiconductor device packages
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United States of America Patent
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Jan 2, 2018
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N/A
app pub date -
Jan 13, 2017
filing date -
May 19, 2016
priority date (Note) -
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Abstract
A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. The passivation layer is disposed on the surface of the substrate. The optical element is disposed in the substrate and exposed from the sidewall of the substrate. The sidewall of the substrate is inclined towards the surface of the substrate at an angle of approximately 87 degrees to approximately 89 degrees.
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