PLATING BATH AND METHOD FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS

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United States of America Patent

SERIAL NO

15520558

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Abstract

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The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising ions of group IIIA metals and iodine containing, inorganic compounds in order to enhance bath stability.

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Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBHERASMUSSTRASSE 20 BERLIN 10553

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKHTAR, Shakeel Berlin, DE 2 0
BEJAN, Iulia Berlin, DE 2 10
BERA, Holger Berlin, DE 7 18
PICALEK, Jan Berlin, DE 2 10
PINNAU, Jennifer Berlin, DE 1 0

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