POLYAMIC ACID, POLYIMIDE RESIN AND POLYIMIDE FILM

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United States of America Patent

SERIAL NO

15021367

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Abstract

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Disclosed is a polyamic acid, which is a polymerized product of a diamine and a dianhydride, wherein the diamine includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA), and the dianhydride includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA). Also, a polyamide resin and a polyimide film, which are imidized products of the polyamic acid, are provided.

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Patent Owner(s)

Patent OwnerAddress
KOLON INDUSTRIES INC(MAGOK-DONG) 110 MAGOKDONG-RO GANGSEO-GU SEOUL 07793

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JUNG, Hak Gee Yongin-si, KR 42 245
YANG, Jong Won Yongin-si, KR 5 5

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