Lamination molding apparatus

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United States of America Patent

PATENT NO 10946558
APP PUB NO 20170334099A1
SERIAL NO

15599535

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Abstract

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A lamination molding apparatus including a chamber covering a molding region; a laser beam source to emit a laser beam for sintering a material powder supplied on the molding region to form a sintered layer; and a scan unit to scan the laser beam. The laser beam has one or more spot shapes including at least an elongated shape, and the scan unit is configured to scan the laser beam, of which the spot shape is an elongated shape, in a lateral direction of the elongated shape, is provided.

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Patent Owner(s)

Patent OwnerAddress
SODICK CO LTDKANAGAWA COUNTY YOKOHAMA JAPAN BUILDING AREA ZHONG TING TAIWAN THREE 12 1 YOKOHAMA-SHI KANAGAWA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Araie, Ichiro Kanagawa, JP 20 139
Okazaki, Shuji Kanagawa, JP 34 300

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