INTERMETALLIC BONDED MULTI-JUNCTION STRUCTURES
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United States of America Patent
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app pub date -
May 12, 2017
filing date -
May 12, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Multiple semiconductor p-n junctions may be built into a single structure to expand the optical capabilities of a device. For example, multi-junction solar cells have improved efficiencies and thus may be desirable for a variety of reasons. Typically, tunnel junctions have been used to connect the plurality of junctions in a two-terminal, layered structure, wherein the junctions are in series electrically and optically. This approach has a variety of drawbacks that lead to higher cost and complexity. The present disclosure embraces an intermetallic bonded multi-junction solar cell that eliminates the problems associated with tunnel junctions and offers additional improvements, such as, photon recycling, light trapping, and simplicity. The present disclosure can also be used as a substitute for wafer bonding with potential advantages for high solar concentration applications. It can also be used in bonding LED structures to achieve white light and dual color LEDs
First Claim
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