Semiconductor Assembly and Method of Fabricating a Semiconductor Structure

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United States of America Patent

SERIAL NO

15655256

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Abstract

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A semiconductor structure and a method of fabricating the same. The semiconductor structure comprises: a layer element, one or more supporting elements disposed on a first surface of the layer element, and one or more anchoring elements disposed within the layer element and connected to the one or more supporting elements to couple the one or more supporting elements to the layer element to strengthen the layer element.

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Patent Owner(s)

Patent OwnerAddress
ADVANPACK SOLUTIONS PTE LTDSINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chew, Hwee Seng Jimmy Singapore, SG 13 62
Lim, Shoa Siong Raymond Singapore, SG 2 1

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