Molded package and method of manufacture
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United States of America Patent
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N/A
Issued Date -
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app pub date -
Oct 7, 2015
filing date -
Oct 13, 2014
priority date (Note) -
Published
status (Latency Note)
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Abstract
A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.
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International Classification(s)
- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 21, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 21, 2031 |
