Method for Manufacturing Pillar or Hole Structures in a Layer of a Semiconductor Device, and Associated Semiconductor Structure
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United States of America Patent
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Oct 28, 2015
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Nov 25, 2014
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The present disclosure relates to a method for manufacturing pillar or hole structures in a layer of semiconductor device, and associated semiconductor structure. At least one embodiment relates to a method for manufacturing pillar structures in a layer of a semiconductor device. The pillar structures are arranged at positions forming a hexagonal matrix configuration. The method includes embedding alignment pillar structures in a backfill brush polymer layer. The method also includes providing a BCP layer on a substantially planar surface defined by an upper surface of the alignment pillar structures and the backfill brush polymer layer. Further, the method includes inducing polymer microphase separation of the BCP polymer layer into pillar structures of a first component of the BCP polymer layer embedded in a second component of the BCP polymer layer.
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