LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS
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United States of America Patent
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Jul 25, 2017
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Jan 29, 2015
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The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.
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