FLUID HANDLING DEVICE AND METHOD FOR MANUFACTURING FLUID HANDLING DEVICE
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United States of America Patent
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app pub date -
Oct 29, 2015
filing date -
Dec 10, 2014
priority date (Note) -
Published
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Abstract
In the present invention, a fluid handling device has: a first substrate made of resin whereon a channel is formed in a first surface; a first film made of resin and joined to the first surface of the first substrate; a second film made of resin a first surface of which is joined to a second surface of the first substrate; and a second substrate made of resin and joined to a second surface of the second film. A recessed part overlapping the channel in a plane view is formed on the surface of the second substrate joined to the second film. The glass transition temperature Tg1s of the first substrate, the glass transition temperature Tg1f of the first film, the glass transition temperature Tg2s of the second substrate, and the glass transition temperature Tg2f of the second film satisfy Tg1s, Tg2s>Tg1f, Tg2f.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
JP | A | JP2016107251 | Dec 10, 2014 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
Published unexamined patent application | 流体取扱装置および流体取扱装置の製造方法 | Jun 20, 2016 | |||
EP | A1 | EP3231507 | Oct 29, 2015 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION PUBLISHED WITH SEARCH REPORT | FLUID HANDLING DEVICE AND METHOD FOR MANUFACTURING FLUID HANDLING DEVICE | Oct 18, 2017 | |||
WO | A1 | WO2016092973 | Oct 29, 2015 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | 流体取扱装置および流体取扱装置の製造方法 | Jun 16, 2016 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ENPLAS CORPORATION | 30-1 NAMIKI 2-CHOME KAWAGUCHI-SHI SAITAMA 332-0034 |
International Classification(s)

- 2015 Application Filing Year
- B29C Class
- 5693 Applications Filed
- 4194 Patents Issued To-Date
- 73.67 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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MURAKI, Koji | Saitama, JP | 10 | 5 |
# of filed Patents : 10 Total Citations : 5 | |||
SUNAGA, Nobuya | Saitama, JP | 32 | 5 |
# of filed Patents : 32 Total Citations : 5 |
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Patent Citation Ranking
- 0 Citation Count
- B29C Class
- 0 % this patent is cited more than
- 8 Age
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