Gas-Cooled 3D IC with Wireless Interconnects

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

15587634

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A three-dimensional integrated circuit includes two or more stacks of one or more active layers; a gas-cooling layer separating the two or more stacks and a wireless interconnect between the two or more stacks enabling communication between the two or more stacks and system including a gas-cooled three-dimensional integrated circuit having wireless data interconnects is disclosed.

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Patent Owner(s)

Patent OwnerAddress
ROCHESTER INSTITUTE OF TECHNOLOGY145 LOMB MEMORIAL DRIVE ROCHESTER NY 14623-5603

International Classification(s)

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  • 2017 Application Filing Year
  • H01L Class
  • 30754 Applications Filed
  • 25260 Patents Issued To-Date
  • 82.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ganguly, Amlan Rochester, US 3 5
Kandlikar, Satish G Rochester, US 21 77

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Patent Citation Ranking

  • 2 Citation Count
  • H01L Class
  • 18.50 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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