Chemically amplified positive-type photosensitive resin composition
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United States of America Patent
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Jan 12, 2021
Grant Date -
Nov 9, 2017
app pub date -
Apr 27, 2017
filing date -
May 6, 2016
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Abstract
A chemically amplified positive-type photosensitive resin composition capable of suppressing occurrence of footing in which the width of the bottom becomes narrower than that of the top in a nonresist section, denaturation of the surface of the metal substrate, and occurrence of a development residue, when a resist pattern serving as a template for a plated article is formed on a metal surface of the substrate having the metal surface by using the composition; a method for manufacturing a substrate with a template by using the composition; and a method for manufacturing a plated article using the substrate with the template. A mercapto compound having a specific structure is contained in the chemically resin composition which includes an acid generator, and a resin whose solubility in alkali increases under the action of acid.
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