FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

15541630

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
UBE EXSYMO CO LTD9-19 NIHONBASHI-TOMIZAWACHO CHUO-KU TOKYO 1030006 ?1030006

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ARIMA, Takao Tokyo, JP 3 29
KASAHARA, Junya Tokyo, JP 4 13
KONDOH, Kouji Kariya-shi, JP 16 134
MIYAGAWA, Eijirou Kariya-shi, JP 10 50
SUZUKI, Taro Tokyo, JP 54 302
TACHIBANA, Eisuke Tokyo, JP 3 39
TOTANI, Makoto Kariya-shi, JP 17 267

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation