Surface acoustic wave device assembly
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United States of America Patent
Stats
-
Apr 14, 2020
Grant Date -
Nov 2, 2017
app pub date -
Jul 17, 2017
filing date -
Feb 3, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A surface acoustic wave device assembly includes a collective board, first circuit portions provided on the collective board and respectively including first hot terminals and first ground terminals, a second circuit portion provided on the collective board and including second hot terminals and second ground terminals, and a power supply wiring provided on the collective board so as to surround the periphery of the first circuit portions and the second circuit portion. The first circuit portions include surface acoustic wave devices defining band pass filters. The second circuit portion defines a band pass filter. The first ground terminals and first hot terminals, and the second ground terminal are connected to the power supply wiring, the second hot terminals are not connected to the power supply wiring, and pass bands of the surface acoustic wave devices and a pass band of the band pass filter defined by the second circuit portion are the same or substantially the same.

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MURATA MANUFACTURING CO LTD | 10-1 HIGASHIKOTARI 1-CHOME NAGAOKAKYO-SHI KYOTO-FU 617-8555 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hira, Mitsuyoshi | Nagaokakyo, JP | 12 | 88 |
Kai, Seiji | Nagaokakyo, JP | 38 | 143 |
Naka, Takashi | Nagaokakyo, JP | 6 | 11 |
Takeshita, Toru | Nagaokakyo, JP | 21 | 119 |
Tsuda, Motoji | Nagaokakyo, JP | 49 | 150 |
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