DEVICES INCLUDING DIELECTRIC LAYERS(S) AND INTERFACE LAYERS(S)
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United States of America Patent
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Nov 2, 2017
app pub date -
Apr 29, 2016
filing date -
Apr 29, 2016
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Abstract
An example device in accordance with an aspect of the present disclosure includes at least one dielectric layer sandwiched between first and second layers, to provide a dielectric characteristic for the device. At least one interface layer, disposed between the at least one dielectric layer and at least one of i) the first layer, and ii) the second layer, is to serve as bond enhancement between the at least one dielectric layer and other layers.
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