BACKLIGHT UNIT AND SIDE VIEW LIGHT-EMITTING DIODE PACKAGE

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United States of America Patent

SERIAL NO

15519762

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Abstract

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A backlight unit and a side view light-emitting diode package are disclosed. The backlight unit includes: a light guide plate; and a light-emitting diode package coupled to the side of the light guide plate, and emitting light to the inside of the light guide plate, wherein the light-emitting diode package includes: a substrate; a pair of leads disposed on both ends of the substrate; a light-emitting diode chip mounted on the upper part of the substrate; a reflection unit disposed to surround the sides of the light-emitting diode chip; and a wavelength conversion unit disposed on the upper part of the light-emitting diode chip and the reflection unit. A light-emitting diode chip is directly mounted on a substrate so as to be manufactured such that an ultra-thin or ultra-slim backlight unit and side view light-emitting diode package can be manufactured.

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Patent Owner(s)

Patent OwnerAddress
SEOUL SEMICONDUCTOR CO LTD97-11 SANDAN-RO 163BEON-GIL DANWON-GU ANSAN-SI GYEONGGI-DO 15429

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JUNG, Seoung Ho Ansan Ho, KR 20 160

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