ISOLATION STRUCTURES FOR CIRCUITS SHARING A SUBSTRATE
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United States of America Patent
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Issued Date -
Nov 2, 2017
app pub date -
Apr 29, 2016
filing date -
Apr 29, 2016
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Abstract
Structures that include isolation structures and methods for fabricating isolation structures. First and second trenches are etched in a substrate and surround a device region in which an integrated circuit is formed. A dielectric material is deposited in the first trench to define a first isolation structure, and an electrical conductor is deposited in the second trench to define a second isolation structure.
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