ELECTRONIC DEVICE WITH ELECTRONIC CHIPS AND HEAT SINK
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United States of America Patent
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Issued Date -
Nov 2, 2017
app pub date -
Nov 30, 2016
filing date -
May 2, 2016
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Abstract
An electronic device includes a first support platelet and a second support platelet that is disposed opposite and at a distance from the first support platelet. At least one first electronic chip is mounted on the first support platelet on a side facing the second support platelet. A second electronic chip is mounted on the second support platelet on a side facing the first support platelet. A heat sink that includes at least one interposition plate is interposed between the first and second electronic chips.
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