METHOD AND APPARATUS FOR LASER-CUTTING OF TRANSPARENT MATERIALS
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Apr 27, 2016
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Apr 27, 2016
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A method for cutting a transparent brittle material using pulsed laser-radiation is disclosed. A beam of pulsed laser-radiation having an optical-axis is focused in the material by a variable-focus lens or mirror. The focus is translated along the optical-axis while the material is moved with respect to the beam to create an array of defects along a cutting path.
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