Solder material, solder paste, solder preform, solder joint and method of managing the solder material
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United States of America Patent
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Jul 21, 2020
Grant Date -
Nov 2, 2017
app pub date -
Nov 5, 2014
filing date -
Nov 5, 2014
priority date (Note) -
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Abstract
Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.
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