Method for Producing a Multi-Layer Substrate and Multi-Layer Substrate
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United States of America Patent
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Aug 12, 2015
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Aug 28, 2014
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A method for producing a multilayer substrate (1) is specified, wherein a main body (26) comprising a plurality of ceramic layers (2) is provided, wherein at least one layer (2) comprises a hole (27). In order to form a plated-through hole (4, 18, 20, 21), the hole (27) is filled with a metal by depositing the metal from a solution. Furthermore, a multilayer substrate is specified wherein a plated-through hole (4, 18, 20, 21) in the interior of the main body (26) is connected to a further contact (11), wherein the plated-through hole (4, 18, 20, 21) comprises a different material than the further contact (11) and/or is produced by a different method.
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