MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LEADFRAMES FOR COMPONENT-ON-PACKAGE CIRCUITS
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United States of America Patent
Stats
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N/A
Issued Date -
N/A
app pub date -
Apr 24, 2017
filing date -
Apr 26, 2016
priority date (Note) -
Published
status (Latency Note)
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Importance

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Non-US Coverage
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Abstract
A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY | BAY F1 RAHEEN INDUSTRIAL ESTATE CO LIMERICK LIMERICK |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
BEVILLE, Frederick E | San Jose, US | 6 | 26 |
# of filed Patents : 6 Total Citations : 26 | |||
BRAZZLE, John David | Tracy, US | 8 | 30 |
# of filed Patents : 8 Total Citations : 30 | |||
PRUITT, David A | San Jose, US | 7 | 52 |
# of filed Patents : 7 Total Citations : 52 |
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Patent Citation Ranking
- 4 Citation Count
- H05K Class
- 18.22 % this patent is cited more than
- 8 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 26, 2025 |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
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Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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