MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LEADFRAMES FOR COMPONENT-ON-PACKAGE CIRCUITS

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United States of America Patent

SERIAL NO

15495405

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.

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Patent Owner(s)

Patent OwnerAddress
ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANYBAY F1 RAHEEN INDUSTRIAL ESTATE CO LIMERICK LIMERICK

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BEVILLE, Frederick E San Jose, US 6 26
BRAZZLE, John David Tracy, US 8 30
PRUITT, David A San Jose, US 7 52

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  • 4 Citation Count
  • H05K Class
  • 18.22 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges392138724467261388321101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0100200300400500600700800900100011001200130014001500

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