ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
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United States of America Patent
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app pub date -
Aug 3, 2016
filing date -
Apr 22, 2016
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Abstract
A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the substrate with the receiving space free from penetrating the substrate. During an encapsulating process, an encapsulant can be filled in the receiving space so as to strengthen the bonding between the substrate and the encapsulant, thereby preventing delamination from occurring therebetween.
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