Ultrasonic transducer having flexible printed circuit board with thick metal layer and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 26, 2017
app pub date -
Dec 22, 2014
filing date -
Dec 22, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An ultrasonic transducer having a flexible printed circuit board with a thick metal layer and a manufacturing method thereof are disclosed. The ultrasonic transducer, according to an embodiment of the present invention, comprises: an active element that generates an ultrasonic signal, wherein the active element has a thickness of ¼λ or less at the center frequency of the generated ultrasonic signal; and a flexible printed circuit board that includes a metal layer with a predetermined thickness, which is formed on one surface of the active element and is electrically connected to the active element, wherein the metal layer blocks ultrasonic waves that propagate in an opposite direction to a predetermined travel path of the ultrasonic waves.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully