Deposition of metal borides and silicides
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United States of America Patent
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Dec 15, 2020
Grant Date -
Oct 26, 2017
app pub date -
Apr 21, 2016
filing date -
Apr 21, 2016
priority date (Note) -
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Abstract
A method for depositing a metal film onto a substrate is disclosed. In particular, the method comprises pulsing a metal halide precursor onto the substrate and pulsing a reducing precursor onto the substrate. A reaction between the metal halide precursor and the reducing precursor forms a metal film. Specifically, the method discloses forming a metal boride or a metal silicide film.
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