POLYIMIDE COPOLYMER AND MOLDED ARTICLE USING SAME
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Sep 29, 2015
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Sep 30, 2014
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An object of the present invention is to provide a polyimide copolymer excelling in solder heat resistance and an adhesive property, and a molded article thereof. A polyimide copolymer is obtained by copolymerizing: (A) an acid dianhydride ingredient; (B) a diamine and/or diisocyanate ingredient represented by the following general formulas (1) to (3):
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