WORKPIECE BONDING METHOD

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United States of America Patent

SERIAL NO

15518364

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Abstract

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Provided is a workpiece bonding method that makes it possible to achieve a joining state with a high strength and to obtain a good repeatability of the joining state.

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Patent Owner(s)

Patent OwnerAddress
USHIO DENKI KABUSHIKI KAISHA1-6-5 MARUNOUCHI CHIYODA-KU TOKYO 1008150 ?1008150

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SUZUKI, Shinji Tokyo, JP 254 2509
TAKEMOTO, Fumitoshi Tokyo, JP 13 85
WASAMOTO, Makoto Tokyo, JP 6 12

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